New Publication: Laser-writable high-k dielectric for van der Waals nanoelectronics

Congratulations to second year XM² postgraduate researcher Konstantinos-Andreas Anastasiou, whose article Laser-writable high-k dielectric for van der Waals nanoelectronics has been published in Science Advances.

State of the art van der Waals heterostructures rely on the use of hexagonal boron nitride as a gate dielectric, a tunnel barrier or a high-quality substrate material. The material is transferred mostly by chemical vapour deposition on top of the two-dimensional (2D) crystals, a technique which typically contains impurities that lead to leakage current in transistor devices. Other common deposition techniques used for SiO2 and HfO2 are not directly compatible with 2D materials and they tend to damage or modify the electronic properties of the underlying 2D crystal. In this paper, the authors demonstrate a method to embed and pattern a multifunctional few-nanometer-thick high-k oxide within various van der Waals devices without degrading the properties of the neighboring 2D. Abstract below.

Abstract

Similar to silicon-based semiconductor devices, van der Waals heterostructures require integration with high-k oxides. Here, we demonstrate a method to embed and pattern a multifunctional few-nanometer-thick high-k oxide within various van der Waals devices without degrading the properties of the neighboring two-dimensional materials. This transformation allows for the creation of several fundamental nanoelectronic and optoelectronic devices, including flexible Schottky barrier field-effect transistors, dual-gated graphene transistors, and vertical light-emitting/detecting tunneling transistors. Furthermore, upon dielectric breakdown, electrically conductive filaments are formed. This filamentation process can be used to electrically contact encapsulated conductive materials. Careful control of the filamentation process also allows for reversible switching memories. This nondestructive embedding of a high-k oxide within complex van der Waals heterostructures could play an important role in future flexible multifunctional van der Waals devices.

Fig. 1 Heterostructure processing and characterization. (A) The heterostructure is fabricated via dry transfer peeling from poly(dimethylsiloxane) membrane (left), the area containing HfS2 is exposed to laser light (center), and the HfS2 is converted into HfOx (right). (B) BF STEM image showing a cross section of a Gr/HfOx device after laser-assisted oxidation (left) and EDX elemental analysis (right). a.u., arbitrary units. (C) Optical image of a graphene-HfS2/MoS2 heterostructure before (top) and after (bottom) oxidation. Black outlines the region of the graphene back gate, green outlines the HfO2, and red outlines the MoS2. (D) Current (Isd) versus applied voltage (Vsd) for the heterostructure in (C) before (red) and after (green) photo-induced oxidation. Inset shows the stacking sequence. (E) Top: Optical micrograph of a HfS2 flake encapsulated between hBN and graphene (green, HfS2; yellow, hBN; red, graphene). Bottom: Optical micrograph of the same heterostructure imaged within our vacuum chamber showing laser irradiation effects in vacuum (blue hatched area) and in air (red hatched area). Note: No obvious oxidation effects are observed when irradiated in vacuum (P ~ 10−5 mbar). (F) Two-terminal resistance versus gate voltage for a graphene on hBN (d ~ 40 nm)/SiO2 (290 nm) FET measured at T = 266 K in a helium atmosphere (blue curve) and after placing a thin HfS2 flake and subjecting it to laser oxidation (red curve; sweep rate = 10 V/min). Inset shows a Raman spectrum of graphene after oxidation plotted on a logarithmic scale showing the G peak and a negligible D peak.
Fig. 1 Heterostructure processing and characterization. (A) The heterostructure is fabricated via dry transfer peeling from poly(dimethylsiloxane) membrane (left), the area containing HfS2 is exposed to laser light (center), and the HfS2 is converted into HfOx (right). (B) BF STEM image showing a cross section of a Gr/HfOx device after laser-assisted oxidation (left) and EDX elemental analysis (right). a.u., arbitrary units. (C) Optical image of a graphene-HfS2/MoS2 heterostructure before (top) and after (bottom) oxidation. Black outlines the region of the graphene back gate, green outlines the HfO2, and red outlines the MoS2. (D) Current (Isd) versus applied voltage (Vsd) for the heterostructure in (C) before (red) and after (green) photo-induced oxidation. Inset shows the stacking sequence. (E) Top: Optical micrograph of a HfS2 flake encapsulated between hBN and graphene (green, HfS2; yellow, hBN; red, graphene). Bottom: Optical micrograph of the same heterostructure imaged within our vacuum chamber showing laser irradiation effects in vacuum (blue hatched area) and in air (red hatched area). Note: No obvious oxidation effects are observed when irradiated in vacuum (P ~ 10−5 mbar). (F) Two-terminal resistance versus gate voltage for a graphene on hBN (d ~ 40 nm)/SiO2 (290 nm) FET measured at T = 266 K in a helium atmosphere (blue curve) and after placing a thin HfS2 flake and subjecting it to laser oxidation (red curve; sweep rate = 10 V/min). Inset shows a Raman spectrum of graphene after oxidation plotted on a logarithmic scale showing the G peak and a negligible D peak.

 

 

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